Wafer Thinning System Precision Thinning Equipment SiC Si Wafer Compatible 4 -12inch Wafer Capacity
Wafer Thinning Equipment Technical Overview
This equipment enables precision thinning of 4-12inch brittle semiconductor materials including silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), and sapphire substrates, achieving thickness control accuracy of ±1 μm and total thickness variation (TTV) ≤2 μm to meet the stringent requirements of advanced packaging and power device fabrication. Through optimized coordination of grinding parameters and polishing processes, the equipment ensures precise adaptation to diverse material properties, particularly addressing the thinning challenges of wide-bandgap semiconductors like SiC. The system guarantees minimal thickness deviation and low surface roughness, integrated with automated real-time thickness monitoring to maintain stable and reliable processing performance.
Wafer Thinning Equipment Specifications
| Equipment Model | Key Advantages |
| 12-inch Semi-Auto Thinner Equipment | - Customizable vacuum chuck solutions for irregular products |
| - Extendable height measurement range up to 40mm |
| - Integrated process solutions |
| 8-inch Full-Auto Thinner Equipment | - UPH surpasses imported models (30pcs/h for standard wafers) |
| - Compatible with semi-auto handling for irregular products |
| - Integrated process solutions |
| 12-inch Full-Auto Thinner Equipment | - Full-Automation System Compatible |
| - Compatible with semi-auto handling for irregular products |
| - Integrated process solutions |
Advantages:
· Mature and stable processing technology
· High-precision In-Feed spindle grinding with superior machining accuracy
· User-friendly operation and ergonomic HMI (Human-Machine Interface)
· Precision Z-axis control via imported ball screws, linear guides, and high-accuracy servo motors (minimum resolution: 0.1 μm/s)
· High-rigidity air-bearing spindle combined with ultra-precise wafer chuck assembly and thickness gauge ensures process stability and reliability
Functions:
· Operation log recording
· 4"-12" wafer material compatibility
· Real-time high-precision contact thickness measurement
· Spindle water cooling system
· Full-auto/Semi-auto operation modes
Wafer Thinning Equipment photo
12-inch Semi-Auto Thinner Equipment 8-inch Full-Auto Thinner Equipment 12-inch Full-Auto Thinner Equipment
Applications
·Silicon-Based Power Device Fabrication: Enables wafer thinning processes for DSC and other silicon power devices
·Compound Semiconductor Device Packaging: Supports substrate-level thinning for GaAs/GaN-based components
·Silicon Carbide Device Processing: Delivers precision thinning of SiC ingots/wafers for power module requirements
Machining effect——Wafer Thinning Equipment
· High-Speed Thinning for SiC, GaN, Sapphire, GaAs, and InP Wafers
· Automated pre-alignment and thickness measurement
· High-rigidity, low-vibration spindle with minimal RPM fluctuation (adjustable creep/rapid feed rates)
